Product Description
The Siemens ASM SIPLACE shielding sheet label feeder handles high-precision automatic feeding of EMI shielding materials for SMT assembly lines. Built on closed-loop servo control with low-tension peeling technology, it feeds copper foil, aluminum, and conductive fabric shielding sheets without tearing or delamination at ±0.1mm accuracy. Compatible with standard SMT reels (150-300mm), the feeder supports tape widths from 2-60mm and thickness from 0.03-0.3mm. Plug-and-play integration with SIPLACE SX, X, and TX series requires no line modifications. Auto-calibration and error alert functions maintain consistent shielding placement during high-volume runs. On SMT production lines, the feeder applies EMI shielding materials to protect sensitive circuits from electromagnetic interference — covering RF modules, power converters, high-speed data lines, and wireless communication circuits. Shielding placement prevents signal degradation, data corruption, and compliance failures in automotive ADAS systems, medical monitoring devices, and 5G communication equipment. Material changeover completes in under 2 minutes with standard reel loading. All compatible shielding materials meet IPC-A-610 Class 3 standards and support RoHS/REACH environmental compliance.
ASM Machine
Machine Performance & Compatible Models
| Model | Description |
|---|---|
| SIPLACE SX | Small-batch shielding sheet feeding, standard SMT reels 150-300mm, compatible with copper foil and aluminum shielding tapes 10-60mm width |
| SIPLACE X3 | ±0.1mm precision feeding, supports thin shielding sheets 0.03-0.3mm, auto-calibration for EMI-sensitive SMT processes |
| SIPLACE X4S | High-speed feeding up to 40 pcs/min, heat-resistant design for automotive electronics shielding applications |
| SIPLACE TX2i | Top-tier precision for large-area shielding sheets, supports high-temp resistant materials, low failure rate for medical and aerospace EMI protection |
| SIPLACE D3i | Compact design for narrow-width shielding tapes 2-25mm, easy maintenance for precision microelectronics assembly |
Supported Materials
| Material Type | Substrate | Conductivity | Temp Resistance | Application |
|---|---|---|---|---|
| Copper Foil Shielding Tape | 35μm copper foil | High conductivity | Up to 300°C | EMI shielding for PCB ground planes, RF shielding, ESD grounding |
| Aluminum Foil Shielding Tape | 20μm aluminum | Medium conductivity | Up to 250°C | Cost-effective EMI shielding, automotive electronics, power modules |
| Silver-Coated Fabric Tape | Silver-plated nylon | Excellent conductivity | Up to 200°C | Flexible shielding for cables, connectors, 5G communication modules |
| Conductive Foam Tape | Conductive polyurethane | High conductivity | Up to 150°C | Gasket replacement, irregular surface shielding, vibration-damping applications |
| EMI Absorber Sheet | Ferrite composite | Absorption type | Up to 180°C | High-frequency noise absorption, signal integrity protection for sensitive circuits |
