Product Description
The Siemens ASM SIPLACE thermal tape feeder delivers high-speed, automated feeding of thermal interface materials directly through the SIPLACE placement head. Closed-loop servo control with real-time tension monitoring feeds thermal pads, tapes, phase change materials, and graphite sheets at up to 60 pcs/min without skew, gaps, or misalignment. Compatible with SIPLACE SX, X3, X4S, TX2i, and D3i machines, the feeder handles tape widths from 2-80mm and thickness from 0.05-5mm. Adjustable peel-off force (0.5-8N) prevents damage to delicate thermal materials during high-speed operation. Designed for feeder cart compatibility, the unit mounts on standard SIPLACE feeder carts for organized material management and quick changeover across production runs. Plug-and-play integration uses standard SIPLACE feeder slots and the same placement head as SMD components — no extra equipment, no line modifications. Auto-calibration and real-time material monitoring detect feeding errors before defective placement occurs. Material changeover completes in under 2 minutes. The SIPLACE Pro interface tracks feeder status, material consumption, and production counts for full traceability.
ASM feeder cart
Feeder Cart Compatibility
| Feeder Cart Model | Compatible Feeders | Slots | Feeder Width | Application |
|---|---|---|---|---|
| ASM SIPLACE FC-8 | SX, X3, X4S, D3i | 8 slots | 8-44mm standard | Small-batch production, quick changeover |
| ASM SIPLACE FC-16 | SX, X3, X4S, TX2i, D3i | 16 slots | 8-88mm standard | Medium-volume SMT lines, feeder organization |
| ASM SIPLACE FC-32 | SX, X3, X4S, TX2i, D3i | 32 slots | 8-88mm standard | High-mix production, multi-product runs |
| ASM SIPLACE FC-TX | TX2i, X4S | 12 slots | 8-120mm wide | Large-format PCB assembly, TX series dedicated |
| ASM SIPLACE FC-HS | All SIPLACE feeders | 24 slots | Mixed width | High-speed lines, feeder management |
ASM label feeder
Supported Materials — Thermal Tape Feeder for PCB Heat Dissipation
| Material Type | Thermal Conductivity | Thickness | Temp Resistance | Application |
|---|---|---|---|---|
| Thermal Pad (Silicone) | 1-10 W/mK | 0.3-3mm | -40°C to +200°C | General PCB heat dissipation, LED drivers, power supplies |
| Thermal Tape (Acrylic) | 0.8-5 W/mK | 0.1-0.5mm | -20°C to +150°C | Thin-profile applications, space-constrained designs, consumer electronics |
| Phase Change Material | 3-8 W/mK | 0.2-1mm | -40°C to +125°C | High-power processors, GPU modules, telecom base stations |
| Thermal Gel / Paste | 4-12 W/mK | 0.05-0.3mm | -50°C to +200°C | Gap filling between uneven surfaces, automotive ECUs, industrial controllers |
| Graphite Sheet | 10-100 W/mK | 0.05-0.5mm | -40°C to +400°C | Ultra-high heat spreading, 5G modules, RF power amplifiers, aerospace electronics |
